MEMS technology is rapidly becoming one of the most important sector in the advancement of innovative technology products. We at ASTER we deal with MUMPs process, especially Silicon-On-Insulator-Multi-User MEMS Process (SOI-MUMPs) along with fabrication of Microfluidic Chips. MUMPs is a process where MEMS device designs from multiple users are shared on a single SOI-wafer or a single chip of 1 cm2 in size.
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WHY US?

TECHNICAL SUPPORT:
  • Fundamental of MEMS Design.
  • Hands-on mask layout design.
  • Characterization Methods.
  • The services are not just limited to microfabrication but also to help the users with technicasupports such as design feasibility, characterization, packaging, etc. Besides, InFAB also helpwith intellectual property such as patents, considering user’s interest.
AFFORDABILITY
  • With the motivation to benefit MEMS users at large and supporting the industry for further innovation we are happy to be providing these devices at affordable cost with less turn-around time.

 



DESIGN SUBMISSION

MEMS devices that can be fabricated using SOI-MUMPs process are: Inertial sensors such as Accelerometer and Gyroscope; Pressure Sensor; Thermal Actuator; RF & DC-MEMS Switch; Micromirror; Microgripper, etc.

 
Process SOI- INFAB
Standard Die Site Die size (mm2) 11 X 11
Design area (mm2) 9 X 9
Number of chips to be delivered 16
Device layer thickness (μm) 10 & 25
Additional processing Sub-dicing Additional Cost

 

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